TAPE CARRIER PACKAGE

Title:

TAPE CARRIER PACKAGE

Document Type and Number:

Japanese Patent JP2685040

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To prevent broken leads due to stress caused by an external force in a tape carrier package.
SOLUTION: In a tape carrier package in which the number of leads differ between lead arrays 4a and 4b arranged on facing sides of a device hole 2, the difference in total lead strength due to the difference in the number of leads between the facing lead arrays 4a and 4b is reduced by increasing the width W of an inner lead included in the lead array 4a which has the smaller number of leads. Thus, the strength of the lead is reinforced so as to be resistant to the stress generated in processes and from the environment.

More Like This:

JP3796181	LEADLESS SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP
JP4480417	Electrode bumps, their manufacture, and their connection methods
JP4961747	Adhesive composition for semiconductor devices, adhesive sheets for semiconductor devices using the same, substrates for connecting semiconductor devices, and semiconductor devices

Inventors:

Takatsu Norio

Application Number:

JP34300495A

Publication Date:

December 03, 1997

Filing Date:

December 28, 1995

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NEC

International Classes:

H01L21/60; (IPC1-7): H01L21/60

Domestic Patent References:

JP5235260A
JP252337U

Attorney, Agent or Firm:

Sugano Naka

Previous Patent: INTER-CLOCK DELAY GENERATING CIRCUIT

Next Patent: SYSTEM FOR AUTOMATICALLY DETECTING MOVING TARGET