PURPOSE: To prevent generation of bubbles and to improve reliability by a method wherein one or more air-bleeding through holes are provided, and the air remaining between a tape-carrier package and a printed wiring board is always made equal to the outside air pressure even after coating of resin.

CONSTITUTION: A rectangular device hole 4 is formed in the center of a tape carrier 1, a plurality of leads 2 are radiately formed from the device hole 4 on the surface of the tape carrier, and air-bleeding holes 3 are formed thereon. The air-bleeding holes 3 are formed on the positions, close to the device hole 4, on the line which links each corner of the device hole 4, used to mount a semiconductor chip, and the tape carrier 1. As a result, the air left between a tape carrier package 10 and a printed wiring board 5 is made equal to the outside air pressure even after an IC package 11 is mounted on the device hole of the tape carrier and the connection part of the connection leads 2 and the IC package 11 is filled up by resin, and the generation of bubbles can be prevented.