Title:
TAPE CARRIER FOR SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011040617
Kind Code:
A
Abstract:
To provide a tape carrier for a semiconductor device, and a method for manufacturing the tape carrier, maintaining excellent joining property to a connection pad or the like of a semiconductor chip and thinning the film of a gold plated layer.
The tape carrier for the semiconductor device is formed with copper wiring 2 on an insulating film 1, and the copper wiring 2 has an inner lead bent and joined to the connection pad of the semiconductor chip. The gold plated layer 3 is formed on the surface of the copper wiring 2, and a coating plated layer 4 superior in oxidation resistance than copper is formed on the surface of the gold plated layer 3.
Inventors:
ARAKAWA YUSUKE
SHIBATA AKIJI
MIYAMOTO NOBUAKI
SHIBATA AKIJI
MIYAMOTO NOBUAKI
Application Number:
JP2009187464A
Publication Date:
February 24, 2011
Filing Date:
August 12, 2009
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
H01L21/60
Attorney, Agent or Firm:
Toru Yui
Hitoshi Kiyono
Fukuoka Masahiro
Hitoshi Kiyono
Fukuoka Masahiro