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Title:
TAPE CARRIER SUBSTRATE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPS55158658
Kind Code:
A
Abstract:

PURPOSE: To obtain a tape carrier which its cost is low and is suitable for an intermediate amount of production of many kinds by a method wherein a metallic film is used as a supporting body of a carrier film and a polyimide film is glued on the metallic film within a range of the necessary minimum.

CONSTITUTION: Feed holes 9 and holes 10a, 10b for positioning a polyimide member are opened to a montifiere metal film 8 while conforming the holes to mounting elements. It is convenient for automatic feed it the pitches l4 are formed in the integral times of the pitches l3 of the feed holes 9. A frame 11 which has a hole 12 at the center and positioning holes 13a, 13b corresponding to the holes 10a, 10b at symmetric corners is formed by punching the polyimide material. Adhesives 14 are applied on the back of the film 8 and glued by using a jig 15. The frame is etched, wiring leads 8a, which cross the frame 11 and have terminal portions projecting to the hole 12 side, are left, and a portion where the internal hole portion and the frame 11 are connected and an external hole portion are removed, thus obtaining the desired tape carrier substrate. According to this constitution, portions using polymide may be small, and an expensive punching metal mold is not required.


Inventors:
NAKAGAWA KOUICHI
BANJIYOU TOSHINOBU
YOSHIDA MIYOSHI
Application Number:
JP6635979A
Publication Date:
December 10, 1980
Filing Date:
May 28, 1979
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/50; H01L21/60; (IPC1-7): H01L21/60; H01L23/50



 
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