Title:
TAPE CUTTER FOR PEELING
Document Type and Number:
Japanese Patent JP2019102769
Kind Code:
A
Abstract:
To cut a tape for peeling without generating powder.SOLUTION: A peeling device 1 comprises: a mounting stage 31 including a mounting surface 32 to which an adhesion agent layer 2b side of a tape for peeling 2 is mounted, and a groove 33 formed in a width direction of the tape 2 for peeling; a pressing part 34 pressing the tape for peeling 2 mounted onto the mounting surface 32 toward the mounting surface 32; a cutting blade 35 including a blade tip 350 obliquely formed on a front side in an advancing direction advancing in the groove 33 along an extended direction of the groove 33, and cutting the tape for peeling 2 by applying a force toward a base material 2a from the adhesion agent layer 2b by the blade tip 350; and movement means 36 of moving the cutting blade 35 in the extended direction of the groove 33. Thus, the blade tip 350 can be made to cut so as to act an outer force toward the base material 2a from the adhesion agent layer 2b. The base material 2a supports the adhesion agent layer 2b when cutting the tape for peeling 2, and the tape for peeling 2 can be cut without generating powder.SELECTED DRAWING: Figure 2
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Inventors:
ITO FUMITETSU
Application Number:
JP2017235914A
Publication Date:
June 24, 2019
Filing Date:
December 08, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B65H35/04; H01L21/301; H01L21/304
Domestic Patent References:
| JP2017123409A | 2017-07-13 | |||
| JP2013234006A | 2013-11-21 | |||
| JP2004063678A | 2004-02-26 | |||
| JP2011023612A | 2011-02-03 | |||
| JP2011210927A | 2011-10-20 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office