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Patent Searching and Data


Title:
TAPE CUTTING DEVICE AND TAPE CUTTING METHOD
Document Type and Number:
Japanese Patent JP2007168045
Kind Code:
A
Abstract:

To provide a tape cutting device and tape cutting method, simple in constitution, preventing dropping of slices, lengthening the life of a cutter and reducing trouble.

This tape cutting device includes: a notch cutter 41 shaped conformable to a notch N formed in a wafer W; an elevating mechanism 42 for inserting and removing the notch cutter 41 to and from the position corresponding to the notch N in a tape T; a circle cutter 51 for cutting the tape T in a circular track; and a circle cutter driving mechanism 52 for moving the circle cutter 51 along the outline of the wafer W. After cutting by the notch cutter 41, the tape T is press-bonded to the wafer W and cut by the circle cutter 51.


Inventors:
TAKIZAWA HIROTSUGU
NISHINA YOSHIAKI
Application Number:
JP2005000371635
Publication Date:
July 05, 2007
Filing Date:
December 26, 2005
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
B26D9/00; B26D1/08; B26D3/10; H01L21/301
Domestic Patent References:
JP2005123420A2005-05-12
JPH05277997A1993-10-26
JPS62114897A1987-05-26
Attorney, Agent or Firm:
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