Title:
TAPE CUTTING MECHANISM IN BINDING APPARATUS FOR SHEAF OF PIECES OF PAPER
Document Type and Number:
Japanese Patent JP3781550
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To cut a tape for binding a sheaf of pieces of paper without applying a drawing force to the tape.
SOLUTION: This tape cutting mechanism in a binding apparatus for a sheaf of pieces of paper is so designed that, after a tape (b) forming a loop around a postal card bundle (a) which is a sheaf of paper is passed around the postal card bundle (a) and drawn, a superposed portion at the ends of the tape (b) are welded, and that the tape is cut off on the feed side at the welded portion. The tape cutting mechanism is moved up relative to a welding auxiliary body 9 disposed at a stopping portion of the tape cutting mechanism so as to be positioned on the underside of the unit set sheet bundle, and sandwiches the superposed ends of the tape (b) between the welding auxiliary body 9 and the tape cutting mechanism when the mechanism is moved up, thus welding the superposed ends of the tape (b). The tape cutting mechanism comprises a heater 10 provided unitarily with a cutter 11, a clamp 12 for grasping the vicinity of the top end of the tape (b) between the welding auxiliary body 9 and the clamp 12, and a cutter receiver 13 which moves up and down unitarily with the cutter 11. Since a shearing force is applied to the tape (b) between the heated cutter 11 and the cutter receiver 13, tension is not required as conventional in practice, and the tape (b) can be easily cut off while being melted.
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Inventors:
Saito Mitsugu
Takashi Nakagawa
Takashi Nakagawa
Application Number:
JP10382898A
Publication Date:
May 31, 2006
Filing Date:
March 31, 1998
Export Citation:
Assignee:
Toppan Forms Co., Ltd.
International Classes:
B65B27/08; B65B13/04; B65B13/32; (IPC1-7): B65B27/08; B65B13/04; B65B13/32
Domestic Patent References:
| JP6278709A | ||||
| JP8026209A |
Attorney, Agent or Firm:
Taichi Chiba