Title:
TAPE AND OTHER METHODS FOR MOUNTING DEVICE ON DEVICE SUBSTRATE
Document Type and Number:
Japanese Patent JPS6181641
Kind Code:
A
Abstract:
A pre-patterned circuit board device-attach transfer tape is described which allows a one step mounting of adhesive patterns on a circuit board in the desired configuration for later mounting of surface mounted devices (e.g., semiconductor dies) thereon. The tape product contains the adhesive pattern in a mirror image to that desired on the exposed surface of the circuit board. The product of the present invention is utilized by bringing the tape product into contact with the circuit board so that the adhesive on the carrier film bonds to the desired surface of the circuit board thereby bringing the adhesive patterns into the desired configuration desired on the circuit board. The use of pressure and, possibly, heat preferentially bonds the adhesive to the circuit board and allows for later stripping of the support film from the support film/adhesive/circuit board composite. This step leaves behind the desired adhesive configuration on the circuit board and allows for later bonding of appropriate surface mounted devices to the circuit board.
Inventors:
UIRIAMU MITSUCHIERU WASURUKO
Application Number:
JP8911585A
Publication Date:
April 25, 1986
Filing Date:
April 26, 1985
Export Citation:
Assignee:
STAUFFER CHEMICAL CO
International Classes:
H01L21/52; H01L21/58; H05K3/20; H05K3/32; H05K1/09; H05K1/18; (IPC1-7): H01L21/60
Domestic Patent References:
| JPS5857730A | 1983-04-06 |
Attorney, Agent or Firm:
Aoki Akira