Title:
テープリーダピンアセンブリ及びこれを製造するための方法
Document Type and Number:
Japanese Patent JP5269400
Kind Code:
B2
Abstract:
A leader pin tape assembly comprising a pin having a first enlarged end and a second enlarged end and at least two flanges located a distance from a corresponding enlarged end to define a recess therebetween and a center section between said flanges.
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Inventors:
Eaton, James
Hines, Robert, Earl.
Mac Alistair, Jeff Ray, Es.
Albrecht, Thomas, Earl.
Von Alten, Thomas, W.
Mansbridge, Geofree, W.
Holiger, Karl, Earl.
Humming, Joan, A.
Hines, Robert, Earl.
Mac Alistair, Jeff Ray, Es.
Albrecht, Thomas, Earl.
Von Alten, Thomas, W.
Mansbridge, Geofree, W.
Holiger, Karl, Earl.
Humming, Joan, A.
Application Number:
JP2007308749A
Publication Date:
August 21, 2013
Filing Date:
November 29, 2007
Export Citation:
Assignee:
Quantum Corporation
International Classes:
G03B1/58; G03B17/30; G11B23/107; G11B15/67; G11B23/26
Domestic Patent References:
| JP11232827A | ||||
| JP11185435A | ||||
| JP11185433A | ||||
| JP52006257Y2 | ||||
| JP61061470B2 |
Foreign References:
| US3934840 | ||||
| US5868333 | ||||
| US4027832 | ||||
| US4364529 |
Attorney, Agent or Firm:
Yasuo Ishikawa
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