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Patent Searching and Data


Title:
TAPE FOR TRANSFERRING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH11105924
Kind Code:
A
Abstract:

To eliminate the separation and deviation of electronic components during the transfer of various kinds of electronic components stuck onto a common pressure sensitive adhesive tape and, further, transfer them in a good state while preventing the electronic components from being deformed at the time of picking them up from the tape by forming an adhesive layer with a plurality of belt-like adhesive layers having different adhesive forces.

This tape base material has feed holes perforated along both ends of its width and is provided with belt-like adhesive layers a1, a2, a3 different in their adhesive forces and the adhesive forces are made greater for the belt-like adhesive layers at the positions nearer both the end of the width. During the transfer of electronic components n1, n2, n3, they are subjected to an acceleration force at the time of the stopping of running or of the resumption of running, and its acceleration force is proportioned to their masses. If such masses of the electronic components are in the order of n1>n2>n3, the electronic components are subjected to greater acceleration in the order of n1>n2>n3, but since the adhesive forces of the belt-like adhesive layers are arranged in the order of a1>a2>a3 and the strengths of adhesive fixing forces for the respective electronic components are arranged in the order of n1>n2>n3, the electronic components can be fixed in a well-balanced state for such acceleration forces.


Inventors:
SATO HIROTAKA
KAIDA KUNIHIKO
Application Number:
JP29047197A
Publication Date:
April 20, 1999
Filing Date:
October 06, 1997
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
B65D73/02; B65D85/86; (IPC1-7): B65D73/02; B65D85/86
Attorney, Agent or Firm:
Matsukatsu Mikatsu