To set electronic parts on a printed circuit board in a well workability, by putting electronic parts turned these backs upward in a number of recesses provided at every specified distance along the longitudinal direction of an embossed carrier tape.
Recesses in which electronic parts are put at every specified distance are formed in the longitudinal direction of an embossed carrier tape 2 made of plastic film. Surface-mounting semiconductor devices 5 are contained in the recesses 3 and a cover tape 4 is stuck with heat and pressure on the area of the openings of the recesses 3 and the peripheral area thereof. In this time, the semiconductor devices 5 are arranged to turn the backs upward or the devices are contained in the recesses 3 of the embossed carrier tape so that the face where lead wires 6 are extended, is arranged in the cover tape 4 side. In this way, electronic parts can be set on a printed circuit board in a well workability.
KAMAMOTO MICHIHISA
YABUNE KAZUHIKO
