Title:
TAPING APPARATUS
Document Type and Number:
Japanese Patent JP3324485
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To improve the working efficiency in the taping of a wire of controlling a tape wound around the wire to be cut by a cutter in a process the wire after the taping is detached from a wire clamp by a wire hand.
SOLUTION: When the taping work to wind an adhesive tape T around the outer circumference of a shield wire W is completed, a manipulator 56 of a wire hand 50 holds the shield wire W, and a guide unit 60 is lowered to hold the taped shield wire W. Then, a wire clamp is automatically opened, and a wire hand 50 projects the delivered shield wire W forward of a cutter 40 from the tapping position and lowers it. An adhesive tape T is pressed against the cuter 40 during the lowering, and cut. Then, the manipulator 56 of the wire hand 50 is released, and the taped shield wire W is discharged.
Inventors:
Matsuzawa, Susumu
Application Number:
JP1998000011627
Publication Date:
July 05, 2002
Filing Date:
January 23, 1998
Export Citation:
Assignee:
SUMITOMO WIRING SYST LTD
International Classes:
B65B27/00; H01B13/012; B65B27/00; H01B13/00; (IPC1-7): B65B27/00; H01B13/00