Title:
テーピング装置
Document Type and Number:
Japanese Patent JP4460040
Kind Code:
B2
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Inventors:
Tomizawa Teruo
Takagi Morido
Takagi Morido
Application Number:
JP2001066822A
Publication Date:
May 12, 2010
Filing Date:
March 09, 2001
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
B65B15/04; B65G47/86; B65G47/91
Domestic Patent References:
JP10059474A | ||||
JP10157707A | ||||
JP11091711A | ||||
JP9223724A | ||||
JP7106796A | ||||
JP3038826U |
Attorney, Agent or Firm:
Kiyotaka Aizawa