Title:
TARGET DEVICE FOR SPUTTERING
Document Type and Number:
Japanese Patent JPS5690974
Kind Code:
A
Abstract:
PURPOSE: To enable a sputter film of arbitrary compositions to be easily formed by juxtaposing a plural of single sputter materials on the surface of a back plate.
CONSTITUTION: Plural pure metals 3a, 3b constituting sputter films are uniformly dispersed on the surface 1a of a back plate 1, and these are disposed alternately or zigzag. The surface 1a of this back plate 1 is so disposed as to oppose to an anode to each other, and with the back plate 1 as cathode, voltage is applied between the anode and the cathode, whereby discharge is caused. If at this time an area ratio of the pure metals 3a, 3b are suitably changed, the sputter film by the alloy of a desired composition ratio is formed on the anode substrate to be sputtered.
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Inventors:
KANBARA SHIGERU
Application Number:
JP16794279A
Publication Date:
July 23, 1981
Filing Date:
December 24, 1979
Export Citation:
Assignee:
TOYO ELECTRONICS IND CORP
International Classes:
C23C14/34; H01L21/203; H01L21/285; (IPC1-7): C23C15/00; H01L21/203; H01L21/285
Domestic Patent References:
| JPS53108884A | 1978-09-22 | |||
| JPS5144754B1 | 1976-11-30 |