Title:
SURFACE TREATMENT FOR COPPER FOIL
Document Type and Number:
Japanese Patent JPH0641761
Kind Code:
A
Abstract:
PURPOSE: To increase adhesiveness of a copper foil to a resin base material without requiring deposition of dendritic or particulate copper.
CONSTITUTION: The surface of a copper foil is treated to form a film essentially comprising oxide or hydroxide of Si, Zr or Ti on the surface. The surface of the copper foil is roughened by the coating film of oxide or hydroxide of Si, Zr or Ti. By using this copper foil to manufacture a copper-laminted plate, adhesiveness of the copper foil to the resin base material is increased.
Inventors:
HIBINO AKINORI
SAWA YOSHIHIDE
TAKANO HIDEKAZU
YOSHIMITSU TOKIO
SAWA YOSHIHIDE
TAKANO HIDEKAZU
YOSHIMITSU TOKIO
Application Number:
JP20092792A
Publication Date:
February 15, 1994
Filing Date:
July 28, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; C23C18/12; H05K3/38; (IPC1-7): C23C18/12; B32B15/08; H05K3/38
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)
Next Patent: SILICONE COMPOSITION