Title:
METHOD FOR EXCHANGING BONDING TOOL IN BONDING DEVICE
Document Type and Number:
Japanese Patent JP3201271
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method capable of easily exchanging a bonding tool without the need of labor and time.
SOLUTION: This method comprises a step for storing the height of a horn 13 or its function value at the time of grounding the lower end part of a used bonding tool 14x to a reference surface L, the step for detaching the used bonding tool 14x from the horn and mounting an unused bonding tool 14y to the horn, the step for keeping the horn as indicated by the stored height or its function value and the step for keeping this state, grounding the lower end part of the unused bonding tool mounted to the horn to the reference surface and fixing the unused bonding tool to the horn.
Inventors:
Takayuki Yoshiyama
Application Number:
JP22093096A
Publication Date:
August 20, 2001
Filing Date:
August 22, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63187637A | ||||
| JP5235104A | ||||
| JP5343462A | ||||
| JP6318838U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)