Title:
屋外装置の温度平均化補償
Document Type and Number:
Japanese Patent JP5826491
Kind Code:
B2
Abstract:
An average-temperature compensated field device comprises a field module, a temperature-averaging sensor, a microprocessor, and an interface. The field module is configured to characterize a process parameter. The temperature-averaging sensor is configured to generate a compensation signal characterizing an extended region of the field device. The microprocessor is configured to compensate a process signal as a function of the compensation signal. The interface is configured to communicate the process signal via a field device communication protocol.
Inventors:
Schumacher, Mark S.
Application Number:
JP2010518174A
Publication Date:
December 02, 2015
Filing Date:
July 11, 2008
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
G01D3/028; G01K3/06; G01K7/026; G01K7/16; G08C19/02
Domestic Patent References:
| JP55170634U | ||||
| JP2002527766A |
Foreign References:
| US20060162459 | ||||
| US20040233034 |
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Tomioka Kiyoshi