To downsize a dimension corresponding to the area of a crystal oscillation chip package without the need for further use of a printed-circuit board on which a part for a temperature compensated circuit is mounted, by allocating a space under a board of the crystal oscillation chip package which has not been utilized in the prior art temperature compensated type crystal oscillator to a part-mounting region.

Under a board 31 a package having a crystal oscillation chip 30, a conductive pattern forming a temperature compensated circuit wiring, external terminals 42, 43, 44, and 45 composed of vertical structures at each corner, a part 47 for a temperature compensated circuit mounted on the lower surface, and a resin molding portion 49, for coating whole lower surface of the board 31 with resin and packaging the part are provided.