Title:
シリコンMEMS共振器のための温度補償
Document Type and Number:
Japanese Patent JP4589920
Kind Code:
B2
Abstract:
Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
More Like This:
Inventors:
Lutz, Marx
Partridge, Aaron
Partridge, Aaron
Application Number:
JP2006509524A
Publication Date:
December 01, 2010
Filing Date:
March 30, 2004
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
H03H3/007; B81B3/00; H01P7/10; H03H9/00; H03H9/02; H03H9/24; H03H9/50; H03H9/54; H03H
Domestic Patent References:
| JP2005500779A | ||||
| JP2001507885A |
Foreign References:
| WO2003017482A1 | ||||
| US6236281 |
Attorney, Agent or Firm:
Kazuo Shamoto
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita