Title:
TEMPERATURE ADJUSTING DEVICE FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING SYSTEM
Document Type and Number:
Japanese Patent JP2023149554
Kind Code:
A
Abstract:
To provide a temperature adjusting device capable of reducing thermal power of a heating unit and a cooling unit necessary to adjust a semiconductor manufacturing device to a target temperature.SOLUTION: A temperature adjusting device 1 comprises: a heating unit 5 which generates a heating liquid; a cooling unit 7 which generates a cooling liquid; a heating liquid transfer tube 8 for transferring the heating liquid to a semiconductor manufacturing device 2; a cooling liquid transfer tube 9 for transferring the cooling liquid to the semiconductor manufacturing device 2; a heating-side return tube 31 for returning a mixed liquid of the heating liquid and the cooling liquid having passed through the semiconductor manufacturing device 2 to the heating unit 5; a cooling-side return tube 32 for returning the mixed liquid having passed through the semiconductor manufacturing device 2 to the cooling unit 7; and at least one of a heating-side heat exchanger 51 which performs heat exchange between the heating liquid and the mixed liquid and a cooling-side heat exchanger 52 which performs heat exchange between the cooling liquid and the mixed liquid.SELECTED DRAWING: Figure 1
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Inventors:
FUKUZUMI YUKIHIRO
NITTA SHINICHI
KUNIYASU NORIO
NITTA SHINICHI
KUNIYASU NORIO
Application Number:
JP2022058188A
Publication Date:
October 13, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
EBARA REFRIGERATION EQUIPMENT & SYSTEMS CO LTD
CKD CORP
CKD CORP
International Classes:
H01L21/3065; C23C16/44; G05D23/13; G05D23/19; H01L21/31
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Isamu Watanabe
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