Title:
温調機構及び液処理装置
Document Type and Number:
Japanese Patent JP7055061
Kind Code:
B2
Abstract:
The purpose of the present invention is to control the temperature of a processing liquid in a short time to a target temperature changed when the target temperature is changed. A temperature control unit (143) controls temperature of a resist liquid to a resist liquid target temperature to supply the resist liquid to an ejection nozzle for ejecting the resist liquid onto a wafer, and includes: a body portion (160) having a thermal conductivity and including a flow passage (160a) for the resist liquid formed therein; a Peltier element (161) provided on at least one surface of the body portion (160); a temperature sensor (162) detecting the temperature of the body portion (160); and a control unit (200) adjusting the temperature of the resist liquid to the resist liquid target temperature by controlling the Peltier element (161) based on a detection result of the temperature sensor (162) to adjust the temperature of the body portion (160) to the body portion′s target temperature.
Inventors:
Tetsuo Fukuoka
Application Number:
JP2018088383A
Publication Date:
April 15, 2022
Filing Date:
May 01, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C11/08; B05C11/10; G03F7/16
Domestic Patent References:
| JP2005197407A | ||||
| JP1220826A | ||||
| JP2003062504A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita