Title:
TEMPERATURE CONTROL METHOD AND PRESSURE OVEN
Document Type and Number:
Japanese Patent JP2023095836
Kind Code:
A
Abstract:
To provide an efficient temperature control method for a cavity at the inside of a pressure oven in a semiconductor manufacturing process.SOLUTION: A pressure oven 200a comprises: a cavity 210; a cooler 230 provided at the inside of the cavity; and an intake unit 250a in communication with the cavity. The intake unit is operated so as to filling the cavity with gas so that an air pressure in the cavity is made higher than a standard atmospheric pressure. The number of gas molecules at the inside of the cavity is larger than the number of gas molecules in the cavity in a standard atmospheric pressure state. When the number of gas molecules at the inside of the cavity is larger than the number of gas molecules in the cavity in a standard atmospheric pressure state, the cooler in the cavity is operated to execute a temperature reduction step with respect to the cavity for reducing the temperature in the cavity. Also provided is a pressure oven.SELECTED DRAWING: Figure 1
Inventors:
CHANG CHING-NAN
Application Number:
JP2022206959A
Publication Date:
July 06, 2023
Filing Date:
December 23, 2022
Export Citation:
Assignee:
ELEAD TECH CO LTD
International Classes:
F27D7/06; F27B17/00; F27D7/02; F27D9/00; F27D19/00
Attorney, Agent or Firm:
TRY International Patent Attorney Corporation
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