To provide a temperature control system that can perform stabler temperature control, and that allows parallel installation of temperature control units including a plurality of heat storage tanks and circulation pumps and has a circulation passage for circulating fluid in the tank.
There is provided a temperature control system 1 comprising: a low temperature adjustment unit 74 for storing fluid of a first temperature; a high temperature adjustment unit 75 for storing fluid of a second temperature higher than the first temperature; a low temperature flow channel 76 through which the fluid from the low temperature adjustment unit flows; a high temperature flow channel 77 through which the fluid from the high temperature adjustment unit flows; a bypass flow channel 73 for circulating the fluid; a combination flow channel 71 through which flows a fluid combined with a combination part PA from three flow channels which are the low temperature flow channel, the high temperature flow channel and the bypass flow channel; a temperature adjustment part 70 for flowing the fluid from the combination flow channel to cool or heat a member used in a semiconductor manufacturing apparatus 100; and a control device 90 which controls a degree of valve opening of a variable valve 79 attached to the three flow channels upstream of the combination part, and adjusts the flow quantity distribution rates of the three flow channels.
TABUCHI ATSUHIKO
WAKAI HIDEKI
ITO KAZUHISA
HIROSE YASUHISA
NISHIKAWA KEIICHI
MINAMITANI TAKAHIRO
CKD CORP
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