Title:
温調装置
Document Type and Number:
Japanese Patent JP7314462
Kind Code:
B2
Abstract:
[Object] To provide a temperature control apparatus designed especially for high-temperature use of circulating liquid in controlling a load to a high temperature.[Solution] In a temperature control apparatus 1 for controlling the temperature of a load by supplying high-temperature circulating liquid to the load, a device in which a helical channel portion 41 of a first heat exchange channel 40 through which circulating liquid flows is housed in a second heat exchange channel 45 formed of a channel space in a hollow shell 44 through which coolant flows is used as a heat exchanger 4 for cooling the circulating liquid, cylindrical members 70 are individually fitted on an inflow channel portion 42 and an outflow channel portion 43 connected to opposite ends of the helical channel portion 41 of the first heat exchange channel 40, and the cylindrical members 70 are each fixed to the shell 44 of the heat exchanger 4 with a weld W.
Inventors:
Ryo Kikuchi
Tatsuya Amano
Haruhiko Tokui
Tatsuya Amano
Haruhiko Tokui
Application Number:
JP2019070764A
Publication Date:
July 26, 2023
Filing Date:
April 02, 2019
Export Citation:
Assignee:
SMC Corporation
International Classes:
F28D7/10; F25D9/00; F25D13/00; F25D17/02
Domestic Patent References:
| JP2011501429A | ||||
| JP2002168551A | ||||
| JP2007100967A | ||||
| JP2011196581A |
Foreign References:
| US6076597 | ||||
| CN203177697U | ||||
| US4895203 | ||||
| US5309987 |
Attorney, Agent or Firm:
Hiroshi Hayashi
Naoki Hayashi
Toru Ishikawa
Naoki Hayashi
Toru Ishikawa