Title:
ICソケットにおける温度検知および予測
Document Type and Number:
Japanese Patent JP2008537637
Kind Code:
A
Abstract:
An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device (20) includes a current sensing device (26) that measures current passing through an IC (24), and a temperature control apparatus (28) that measures a surface temperature of the IC (24). The device further includes an electronic controller (30) that calculates the power consumed by the IC (24) according to the measured current and adjusts the temperature of a heater or cooler (28) responsive to the measured surface temperature and power consumption.
Inventors:
Lopez, Christopher, A.
Den Heye, Brian, J.
Den Heye, Brian, J.
Application Number:
JP2008500780A
Publication Date:
September 18, 2008
Filing Date:
March 03, 2006
Export Citation:
Assignee:
WELLS-CTI, LLC
International Classes:
H01L23/34; G01K1/14
Domestic Patent References:
| JP2000304804A | 2000-11-02 |
Attorney, Agent or Firm:
Kazuo Asahi
Tatsuya Masuda
Tatsuya Masuda