Title:
TEMPERATURE ESTIMATION SYSTEM, TEMPERATURE ESTIMATION DEVICE, TEMPERATURE ESTIMATION METHOD, AND PROGRAM
Document Type and Number:
Japanese Patent JP2017049079
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To enable a variety of materials to be used as materials used for temperature estimation.SOLUTION: A temperature estimation device comprises: a thermal expansion unit that expands with heat; a restriction unit for restricting either the expansion or the contraction of the thermal expansion unit; a state quantity measurement unit for measuring a state quantity attributable to plastic deformation caused by restriction of either the expansion or the contraction of the thermal expansion unit due to a temperature change; a correspondence information storage unit for storing correspondence information between the state quantity attributable to plastic deformation caused by restriction of either the expansion or the contraction of the thermal expansion unit and the temperature of the thermal expansion unit; and a temperature estimation value acquisition unit for acquiring the estimated value of highest attainment temperature or the estimated value of lowest attainment temperature of the thermal expansion unit on the basis of the state quantity measured by the state quantity measurement unit and the correspondence information stored by the correspondence information storage unit.SELECTED DRAWING: Figure 1
Inventors:
OGAWA MASA
TAKAHASHI RYUTARO
TAKAHASHI RYUTARO
Application Number:
JP2015171528A
Publication Date:
March 09, 2017
Filing Date:
August 31, 2015
Export Citation:
Assignee:
NAT UNIV YOKOHAMA
International Classes:
G01K5/62
Attorney, Agent or Firm:
Masatake Shiga
Yasushi Matsunuma
Masato Iida
Akio Sato
Yasushi Matsunuma
Masato Iida
Akio Sato