To improve mechanical stability in a packaging soldering position in a temperature fuse built-in resistor by guaranteeing sure prevention of heat damage of the temperature fuse at the point of packaging soldering to a circuit substrate and then obtaining reduction in case height in the temperature fuse built-in resistor.

The temperature fuse built-in resistor has two pieces of resistors 2 and 2' and one piece of temperature fuse 3' stored in a case 1'. Lead conductors 23 and 23 on one end side of each resistor are guided out of the case 1 in parallel. The temperature fuse 3 is connected between other ends of both resistors 2 and 2. Heat resistant sealing material 4 is filled in the case 1.