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Patent Searching and Data


Title:
TEMPERATURE FUSE AND WIRE MATERIAL FOR TEMPERATURE FUSE ELEMENT
Document Type and Number:
Japanese Patent JP2002025406
Kind Code:
A
Abstract:

To provide a temperature fuse which can secure meltdown temperature from 175°C or higher to 185°C or lower, and a wire material for a temperature fuse element suitable for manufacturing of this temperature fuse.

The temperature fuse is a temperature fuse, having a fuse element melting at a given temperature, and the fuse element is formed from a fusible alloy, consisting of bismuth of 1 weight% or more and 10 weight% or less, zinc of 3 weight% or more and 13 weight% or less and the rest of tin. Furthermore, a wire material for the temperature fuse element is also formed from a fusible alloy of similar composition. That it to say, by adjusting the bismuth content and indium content in the fusible alloy, a temperature fuse and the wire material are provided with superior fusion temperature characteristics and with moderate strength and ductility.


Inventors:
Narita, Katsuhiko
Hara, Shiro
Application Number:
JP2000000200945
Publication Date:
January 25, 2002
Filing Date:
July 03, 2000
Export Citation:
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Assignee:
SORUDAA KOOTO KK
International Classes:
C22C13/02; H01H37/76; (IPC1-7): H01H37/76; C22C13/02