Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
TEMPERATURE FUSE WITH RESISTANCE
Document Type and Number:
Japanese Patent JP2009037935
Kind Code:
A
Abstract:

To provide film electrodes for substrate type resistance connection, which proficiently prevent the occurrence of migration between the film electrodes even though they are used under a high humidity environment.

The film electrodes 2, 2 for fusible alloy element connection and the film electrodes 4, 4 for resistance connection are arranged on one face of a substrate 1. A fusible alloy element 3 is connected between the film electrodes 2, 2 for fusible alloy element connection; a film resistance 5 is connected between the film electrodes 4, 4 for resistance connection; a glass protective film 6 is arranged by covering the film electrodes for resistance connection and the film resistance; and a flux 7 is applied on the glass protective film 6 without keeping in contact with the glass protective film 6 by covering the fusible alloy element 3 and a film electrode section for fusible alloy element connection in the vicinity of each end of the element.


Inventors:
Hattori, Norisuke
Nose, Hiroyoshi
Rokkasho, Yuji
Application Number:
JP2007000202417
Publication Date:
February 19, 2009
Filing Date:
August 03, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; H01H69/02