Title:
TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP2009295413
Kind Code:
A
Abstract:
To provide a temperature fuse that improves the yield of a product.
In the temperature fuse, an adhesive layer 16 arranged between a first insulation film 13 and a second insulation film 15, between first and second metal terminals 11, 12 and the second insulation film 15, is constituted of a resin of which the softening point is lower than that of a resin constituting the first insulation film 13 and the second insulation film 15.
Inventors:
Nagafuji, Kohei
Senda, Kenji
Isaki, Masatoshi
Kono, Tokuji
Senda, Kenji
Isaki, Masatoshi
Kono, Tokuji
Application Number:
JP2008000147761
Publication Date:
December 17, 2009
Filing Date:
June 05, 2008
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01H37/76; H01H37/00