Title:
温度湿度交換器
Document Type and Number:
Japanese Patent JP4312624
Kind Code:
B2
Abstract:
Heat humidity exchanger having reliably gas-sealed gas manifolds (5-8) and delivering a gas at high pressure and high dew-point temperature, wherein upper and lower seal portions (30,31) surrounding gas manifolds to which the gas is supplied or from which the gas is discharged are provided. The upper and lower seal portions (30,31), which partially extend across an aggregate communication groove (36,37), are respectively constituted by upper and lower seal formation plates (32-35) that are arranged in a two-stage manner in a laminating direction. The upper and lower seal portions (30,31) have flat faces extending in the laminating direction. Furthermore, the upper and lower seal formation plates (32-35) are disposed such that their projections in the laminating direction are offset from each other.
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Inventors:
Matsumura Mitsuie
Yoshihide
Hideo Ichimura
Yoshihide
Hideo Ichimura
Application Number:
JP2004037351A
Publication Date:
August 12, 2009
Filing Date:
February 13, 2004
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
F28F3/08; F28D21/00; F28F3/10; H01M8/02; H01M8/04
Domestic Patent References:
JP4313693A | ||||
JP62242791A | ||||
JP2002195785A | ||||
JP2003314983A | ||||
JP5038027A | ||||
JP6124722A | ||||
JP2002170584A |
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
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