PURPOSE: To obtain an inexpensive and highly durable temperature measuring device being formed at a plurality of positions on the major surface of a semiconductor wafer in which the temperature can be measured conveniently and accurately with high resolution over a wide range by providing a bimetal structure and means for recording displacement based on the temperature of a bimetal.

CONSTITUTION: The temperature measuring device 506 is formed at a plurality of required parts in a semiconductor wafer. The device 506 comprises a bimetal 502, a movable chip 508, graduations 505, and a guide groove 504. The chip 508 is shifted to abut against the bimetal 502. When the temperature of the semiconductor wafer exceeds a level at some point in time, the bimetal 502 bends to the left to shift the chip 508 and the temperature at that moment is read out on the graduation 505. When the temperature of the semiconductor wafer drops, the bimetal 502 is shifted to the right but the chip 508 is not shifted but left at the position of highest temperature and thereby the highest point in the temperature cycle can be determined. When the semiconductor wafer is inclined again and the chip 508 is shifted, it can be used repeatedly.