Title:
TEMPERATURE MEASURING DEVICE AND METHOD, AND TEMPERATURE CHARACTERISTIC DECISION METHOD FOR TEMPERATURE DETECTION DIODE
Document Type and Number:
Japanese Patent JP2007024860
Kind Code:
A
Abstract:
To provide a temperature measuring device capable of a non-contact measurement of a temperature of an IGBT chip.
In the temperature measuring device 201, a power semiconductor module 10 mounted a heating plate 22 is heated to a predetermined temperature by a heating of a heater 21 with temperature control. Then, the temperature characteristic of the temperature detection diode assembled in the power semiconductor module 10 is measured. The measuring window 22h penetrating the upper and lower surfaces is formed at a central part of the heating plate 22. An infrared ray intensity irradiated from a metal base plate 11 is measured by a radiation thermometer 24 through this measuring window 22h.
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Inventors:
YOSHIMURA HIROYUKI
Application Number:
JP2005367801A
Publication Date:
February 01, 2007
Filing Date:
December 21, 2005
Export Citation:
Assignee:
FUJI ELEC DEVICE TECH CO LTD
International Classes:
G01K15/00; G01J5/00; G01J5/06; G01K7/01
Attorney, Agent or Firm:
Takeshi Hattori