TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD USING SAME

Title:

TEMPERATURE MEASURING DEVICE AND TEMPERATURE MEASURING METHOD USING SAME

Document Type and Number:

Japanese Patent JP05335284

Kind Code:

A

Abstract:

PURPOSE: To provide highly accurate temperature measuring device and method with a simplified structure.

CONSTITUTION: In a temperature measuring device 1 including a temperature measuring part 3 disposed on a silicon plate 2 at a predetermined location of the same, a predetermined capacity recess 4 is provided in the upper surface of the silicon plate 2, and a space in the recess 4 is brought into a closed state by depositing a thin film 5 in the recess 4, into which space gas is introduced at a predetermined pressure. The silicon plate 2 is heated and the gas in the recess 4 is expanded, so that the thin film 5 deposited in the recess 4 is swelled out. Temperature of the silicon plate 2 is determined by measuring the swelled height of the thin film 5.

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Inventors:

Sugano, Yukiyasu

Application Number:

JP1992000170230

Publication Date:

December 17, 1993

Filing Date:

June 03, 1992

Export Citation:

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Assignee:

SONY CORP

International Classes:

G01K5/32; H01L21/302; H01L21/3065; H01L21/66; G01K5/00; H01L21/02; H01L21/66; (IPC1-7): H01L21/302; G01K5/32; H01L21/66

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