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Title:
TEMPERATURE MEASURING METHOD, TESTING METHOD USING THE SAME, SEMICONDUCTOR TESTER AND SEMICONDUCTOR CHARACTERISTICS ESTIMATING METHOD
Document Type and Number:
Japanese Patent JP3946964
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To test a wafer at a high accuracy in a screening tester for testing semiconductor elements being energized in the wafer.
SOLUTION: An evaluator 21 evaluates characteristics of e.g. a diode 11a at a known temperature and characteristics at an unknown temperature with the diode 11a energized for its running test. Based on the evaluation result, a control computer 25 estimates the true temperature of the diode 11a in the running test and controls a controller 27 of Peltier coolers 13a-13f, based on the estimation result, to locally control the temperature of a mount base 12 so that the temperatures of all diodes 11a in the wafer 11 are equal, thus enabling the test of all the diodes 11a with the same load.


Inventors:
Akio Tabata
Application Number:
JP2001078288A
Publication Date:
July 18, 2007
Filing Date:
March 19, 2001
Export Citation:
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Assignee:
Toshiba Electronic Engineering Co., Ltd.
Toshiba Corporation
International Classes:
G01R31/26; H01S5/024; H01L21/66; H01S5/06; (IPC1-7): H01L21/66; G01R31/26; H01S5/024; H01S5/06
Domestic Patent References:
JP3044949A
JP5157632A
JP4280447A
JP4268466A
JP2243948A
JP61154192A
JP59178742A
JP2001021610A
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto