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Patent Searching and Data


Title:
TEMPERATURE SENSING STRUCTURE OF FLOORBOARD AND ITS TEMPERATURE SENSING METHOD
Document Type and Number:
Japanese Patent JPH09159538
Kind Code:
A
Abstract:

To provide a structure to accurately sense a temperature and its temperature sensing method.

A temperature sensing structure of a floorboard 2 is formed of a temperature sensor 1 formed in a floorboard inserting shape by shutting up a sensor 5 inside a metallic plate body 3 having the prescribed size and the temperature sensing floorboard 2 where an inserting hole 8 into which the temperature sensor 1 is inserted is formed on a lengthwise directional one side surface. According to this structure, heaters can be directly installed on both sides of the temperature sensing floorboard 2, and when the temperature sensor 1 is inserted into the inserting hole 8 of the floorboard 2, the sensor 5 senses a temperature of the floorboard through a surface of the plate body 3.


Inventors:
MAJIMA TAKESHI
ABE MASAHIKO
KOSHIBA HIROAKI
YOSHINO KOJIRO
Application Number:
JP31823295A
Publication Date:
June 20, 1997
Filing Date:
December 06, 1995
Export Citation:
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Assignee:
SHINYOUSHIYA KK
International Classes:
G01K1/14; E01B7/24; G01K7/18; (IPC1-7): G01K1/14; G01K7/18
Attorney, Agent or Firm:
Saburo Takeuchi (1 person outside)