To provide a temperature-sensitive circuit breaker film and a conductive circuit apparatus using the above apparatus with an ensured response in a lower temperature range of around 35°C to 60°C, easy to assemble and capable of being downsized, and a method of manufacturing a temperature-sensitive circuit breaker film.

The temperature-sensitive circuit breaker membrane apparatus is composed of a base plate 1, an electrode 2 having at lease one pair of electrodes 2a, 2b fixed on the base plate, a cylindrical resin film 3 placed between the electrodes and having an opening 31 on one side or both sides in a direction of communication between the electrodes, and a thread- or rod-shaped conductive paraffine membrane 4 housed in the resin film so that a part each of its both ends is projected from the openings and placed to communicate between the electrodes. The resin film contains in itself a conductive paraffine membrane and is pressed together with the conductive paraffine membrane. The resin film has a heat-responsive deformation property and the conductive paraffine membrane has a lower melting point than a deformation temperature of the resin film, and as a result, is cut into pieces at the opening by the heat-responsive deformation of the resin film.