To provide a temperature sensitive circuit breaking device having responsiveness at low temperature from 35°C to about 60°C and making miniaturization possible, and to provide a current carrying circuit device using this.

A temperature sensitive circuit breaking film device has a substrate 1, at least a pair of electrodes 2a, 2b installed on the substrate, resin films 3a, 3b arranged between the electrodes 2a, 2b, and a conductive paraffine film 4 integrated with the resin films 3a, 3b, and connecting the electrodes 2a, 2b, and the resin films 3a, 3b interpose the conductive paraffine film 4 between its upper and lower parts, the resin films 3a, 3b have heat responding deformation properties, the conductive paraffine film 4 has a melting point lower than the deformation temperature of the resin films 3a, 3b, and is cut by the heat responding deformation.