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Patent Searching and Data


Title:
TEMPERATURE-SENSITIVE TYPE CIRCUIT BREAKING FILM DEVICE AND ELECTRICITY SWITCHING-ON CIRCUIT DEVICE USING THIS
Document Type and Number:
Japanese Patent JP2006155966
Kind Code:
A
Abstract:

To provide a new temperature-sensitive type circuit breaking film device which has a steady response at low temperatures from 35°C or more to about 60°C, and can be made small in size, and an electricity switching-on circuit device using this.

The temperature-sensitive type circuit breaking film device comprises a substrate 1, at least a pair of electrodes 2A, 2B provided on the substrate 1, a resin film 3 arranged between the electrodes 2A, 2B, a conductive paraffin film 4 arranged so as to communicate between the electrodes 2A, 2B. The resin film 3 clips the conductive paraffin film 4 at its upper and lower parts, and a part of it is formed in a bag enclosure-shape part at one end or both end parts in communication direction of the electrodes 2A, 2B of the conductive paraffin film 4. The resin film 3 has heat sensitive deformability and the conductive paraffin film 4 has a melting point lower than the deformation temperature of the resin film 3, and is cut apart at the bag enclosure-shape part by heat responsive deformation of the resin film 3.


Inventors:
Hino, Hirohisa
Fukui, Taro
Application Number:
JP2004000341327
Publication Date:
June 15, 2006
Filing Date:
November 25, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01H37/76