Title:
温度センサ素子及びこれを用いた放射温度計
Document Type and Number:
Japanese Patent JP5824690
Kind Code:
B2
Abstract:
Disclosed are a temperature sensor device using a thermopile, the total number n of thermocouples thereon can be increased without greatly increasing the internal resistance of the thermopile r, providing high output level and high S/N ratio, a highly sensitive radiation thermometer using the device, and production method of the device using organic material for thin films to form the thermopile. These provide a standardized inexpensive multi-layered thin film thermopile, a radiation thermometer with high sensitivity, and production method of these devices. The temperature sensor device is a device wherein a thermopile which is formed on a thin film thermally isolated from a substrate is place in a temperature sensing part, and the thin film is formed as a multi-layered thin film, a layered thermopile is formed on each layered thin film, the substrate functioning as a heat sink which is one junction of the reference temperature of the thermopile.
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Inventors:
Mitsuteru Kimura
Nobuo Tanaka
Hironori Shimobayashi
Nobuo Tanaka
Hironori Shimobayashi
Application Number:
JP2012512847A
Publication Date:
November 25, 2015
Filing Date:
April 26, 2011
Export Citation:
Assignee:
H.M.E Co., Ltd.
Tohoku Gakuin
Tohoku Gakuin
International Classes:
G01J5/12; G01J1/02; G01J5/48; H01L35/32
Domestic Patent References:
| JPH02165025A | 1990-06-26 | |||
| JPH06260686A | 1994-09-16 |
Attorney, Agent or Firm:
Hisao Fukumori