Title:
温度センサ接合部検査装置、及び、温度センサ接合部検査方法
Document Type and Number:
Japanese Patent JP5420461
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an inspection apparatus of a temperature sensor bonding section, and to provide an inspection method of a temperature sensor bonding section for accurately inspecting the quality of a solder bonding section in a temperature sensor by a low-cost and readily introduced method.SOLUTION: In the inspection method of the temperature sensor bonding section for inspecting the bonding state of the temperature sensor 5 bonded on a DCB substrate 3 for mounting an IGBT 4 by a solder, a current flows in the temperature sensor 5. The temperature of a heat dissipating base section 37 disposed on the DCB substrate 3 and a temperature of the temperature sensor 5 are measured. A thermal resistance is calculated, based on the difference between the temperatures of the heat dissipating base section 37 and the temperature sensor 5. The calculated thermal resistance is compared with a preset threshold of the thermal resistance, and the solder bonding section 35 in the temperature sensor 5 is inspected.
Inventors:
Kimura
Hiroshi Akita
Yamada Tomoko
Hiroshi Akita
Yamada Tomoko
Application Number:
JP2010070620A
Publication Date:
February 19, 2014
Filing Date:
March 25, 2010
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
G01N19/04; G01K3/14; G01N25/72; H05K1/02; H05K3/34
Domestic Patent References:
| JP2005310884A | ||||
| JP2006108256A | ||||
| JP2006140192A | ||||
| JP2007040786A | ||||
| JP2007115924A |
Attorney, Agent or Firm:
Patent Business Corporation Kushibuchi International Patent Office