Title:
温度センサ
Document Type and Number:
Japanese Patent JP5312239
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature sensor capable of improving accuracy of measurement by improving adhesion between a part to be measured and a temperature measuring surface of a sensor body by enhancing a pressing load working on a locking arm, and improving productivity or reducing cost by mitigating a dimension tolerance of a partner shape on which the temperature sensor is to be mounted.SOLUTION: In the temperature sensor 21 wherein a free end of the locking arm 25 extending from a sensor body 23 is mounted on the part to be measured while the pressing load on the side of the part to be measured is received, and an adhesion state between the temperature measuring surface 23a of the tip of the sensor body 23 and the part to be measured is secured by elastic restoring force of the locking arm 25, the locking arm 25 is provided on a flexible member 33 elongated elastically deformably on the sensor body 23.
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Inventors:
Kazuyuki Matsunaga
Application Number:
JP2009162867A
Publication Date:
October 09, 2013
Filing Date:
July 09, 2009
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
G01K1/14
Domestic Patent References:
| JP2006140054A | ||||
| JP2008298662A |
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa
Hironori Honda
Toshimitsu Ichikawa