Title:
TEMPERATURE SENSOR
Document Type and Number:
Japanese Patent JPS63145930
Kind Code:
A
Abstract:
PURPOSE:To facilitate the making of a temperature sensor, by a method wherein a thermoresistance element or the like is included by an electrically insulating liquid synthetic resin to form an internal synthetic resin layer by solidifying the resin and the internal synthetic resin layer is included by the same material to form an external synthetic resin layer by solidifying the resin material. CONSTITUTION:A thermistor 20, two bare core wires 14a, a resistance element 30 and cover ends 12a and 13a are immersed into a liquid epoxy resin material and then, the resin material is solidified by drying to form an internal synthetic resin layer 40. Then, the resin layer 40 and a cover end 11a of an external cover layer 11 are inserted into a die filled with a liquid ABS2 synthetic material and after the liquid ABS2 synthetic material is solidified by drying, the die is removed to form an external synthetic resin layer 50. This enables manufacture with such a simple work at a lower cost and also allows compactization by employing a chip type thermistor 20 and a chip type resistance element 30.
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Inventors:
MORIYA MITSUTOSHI
FUWA KATSUHIKO
NINOMIYA MORIMASA
BANDO SHIGERU
FUWA KATSUHIKO
NINOMIYA MORIMASA
BANDO SHIGERU
Application Number:
JP18728686A
Publication Date:
June 18, 1988
Filing Date:
August 08, 1986
Export Citation:
Assignee:
NIPPON DENSO CO
OIZUMI SEISAKUSHO KK
OIZUMI SEISAKUSHO KK
International Classes:
G01K7/22; (IPC1-7): G01K7/22
Domestic Patent References:
| JPS5640602U | 1981-04-15 | |||
| JPS55161232U | 1980-11-19 | |||
| JPS55134325A | 1980-10-20 |
Attorney, Agent or Firm:
Sugano Naka