Title:
仮接着層形成用組成物及び仮接着層
Document Type and Number:
Japanese Patent JP7184043
Kind Code:
B2
Abstract:
A composition for forming a temporary bonding layer, which is used for the purpose of forming a temporary bonding layer that affixes a resin substrate onto a base material, and which contains (A) a polyamic acid of formula (P1), (B) a polyamic acid of formula (P2), (C) a silane coupling agent having an amino group or the like, and (D) a mixed solvent that contains an amide-based solvent or the like. (In formula (P1), X1 represents a divalent aromatic group having two carboxy groups and an ester bond, or the like; and Y1 represents a divalent aromatic group having an ester bond, or the like.) (In formula (P2), X2 represents a divalent aromatic group having two carboxy groups and an ether bond, or the like; and Y2 represents a divalent aromatic group having an ether bond, or the like.)
Inventors:
Leaf Zhenjia
Kazuya Ehara
Kazuya Shindo
Kazuya Ehara
Kazuya Shindo
Application Number:
JP2019545599A
Publication Date:
December 06, 2022
Filing Date:
September 27, 2018
Export Citation:
Assignee:
Nissan Chemical Co., Ltd.
International Classes:
C09J179/08; B32B7/023; B32B27/34; C09J7/35; C09J11/06
Domestic Patent References:
| JP2017141317A | ||||
| JP2014218394A | ||||
| JP201411179A | ||||
| JP200311308A | ||||
| JP967558A |
Foreign References:
| WO2016129546A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Eimei International Patent Office
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