Title:
接着フィルム構造体、接着フィルム収容体、および接着フィルム構造体の仮貼り方法
Document Type and Number:
Japanese Patent JP6562792
Kind Code:
B2
Abstract:
[Problem] To provide an adhesive film structure, an adhesive film accommodating body, and a method for temporarily adhering an adhesive film structure, with which the efficiency of a temporary adhesion step can be improved. [Solution] An adhesive film structure comprises: a plurality of adhesive films in which an adhesive layer is provided on one surface of a film substrate; and a connecting tape in which a bonding layer is provided on a tape main body, and which connects the ends of the adhesive films to each other via the bonding layer on the other surface of the film substrate that opposes the one surface. The overall film thickness of the connecting tape is 0.3 times to 0.7 times the film thickness of the film substrate, and the film thickness of the bonding layer is 0.16 times to 0.36 times the film thickness of the film substrate.
Inventors:
Hamasaki Kazunori
Application Number:
JP2015181562A
Publication Date:
August 21, 2019
Filing Date:
September 15, 2015
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
B32B3/14; B32B27/00; C09J7/20; C09J9/02; C09J201/00; H01L31/05
Domestic Patent References:
| JP2004202738A |
Attorney, Agent or Firm:
Nobuhiro Noguchi