Title:
仮固定用フィルム、仮固定用フィルムシート及び半導体装置
Document Type and Number:
Japanese Patent JP6443343
Kind Code:
B2
Abstract:
The film for temporary fixing of the present invention is a film for temporary fixing which is used in a processing method of a semiconductor wafer, the method including a temporary fixing step of temporarily fixing the semiconductor wafer to a support via the film for temporary fixing, a processing step of processing the semiconductor wafer that is temporarily fixed to the support, and a separation step of separating the processed semiconductor wafer from the support and the film for temporary fixing, contains (A) a high molecular weight component and (B) a silicone-modified resin, and has a modulus of elasticity of from 0.1 to 1000 MPa at 23° C. after being heated for 30 minutes at 110° C. and for 1 hour at 170° C.
Inventors:
Takahiro Tokuyasu
Natsukawa Masanori
Yasuyuki Oyama
Natsukawa Masanori
Yasuyuki Oyama
Application Number:
JP2015554949A
Publication Date:
December 26, 2018
Filing Date:
December 24, 2014
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/683; C09J7/10; C09J11/06; C09J133/00; C09J167/00; C09J183/04; C09J201/00; C09J201/02; H01L21/02; H01L21/304
Domestic Patent References:
| JP2011054939A | ||||
| JP3263475A | ||||
| JP2009083271A | ||||
| JP2012126803A | ||||
| JP2005028734A | ||||
| JP2005120206A | ||||
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| JP5157229B2 | ||||
| JP4732472B2 | ||||
| JP5343450B2 | ||||
| JP2010126598A | ||||
| JP2011102383A | ||||
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Foreign References:
| WO2010137443A1 | ||||
| US20090075008 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano