Title:
TEMPORARY FIXING MATERIAL AND TEMPORARY FIXING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2017193650
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a temporary fixing material capable of peeling a resin surface where a resin is coated on a substrate of a body to be coated with a treatment by a hot water or the like without residual and a temporary fixing method using the same.SOLUTION: There is provided a temporary fixing material adhering the temporary fixing material and a body to be coated and capable of peeling the temporary fixing material and the body to be coated by a treatment, the temporary fixing material contains a polyamide imide resin, has number average molecular weight of the polyamide imide resin of 22,000 to 50,000, terminal group treated by a block agent, having a biphenyl group in a repeating unit of the polyamide imide resin and the biphenyl group is 20 to 60 mol% based on total amount of a skeleton derived from isocyanate or amine component of the polyamide imide resin.SELECTED DRAWING: None
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Inventors:
HARADA YUTA
Application Number:
JP2016085274A
Publication Date:
October 26, 2017
Filing Date:
April 21, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J179/08; C08G18/34; C09J5/00
Domestic Patent References:
| JP2014220348A | 2014-11-20 | |||
| JP2007100079A | 2007-04-19 | |||
| JP2009021322A | 2009-01-29 | |||
| JP2007056066A | 2007-03-08 |
Attorney, Agent or Firm:
Kazuyasu Minagawa