To prevent the generation of flaws or attachment of contamination by effectively protecting a bonding surface in integrating a terminal, including the bonding surface with a housing main body through resin molding.

A recessed place 70 is provided in one surface of a terminal 52 exposed on the outer side, and a bottom part of the recessed place 70 is set as a bonding surface. Contact of a resin molding die with the bonding surface on the terminal 52 side is thus avoided. The suitable recessed place 70 is positioned on an inner circumference of an edge part of one surface of the terminal 52, and the periphery of the recessed place 70 is entirely enclosed by one surface of the terminal 52. Since this recessed place 70 is entirely enclosed by one surface of the terminal 52, the bottom part of the recessed place 70 is not damaged, and the recessed place 70 of the terminal 52 is closed tightly, when it is set in the die.