Title:
端子電極形成方法及びそれを用いた圧電／電歪素子の製造方法
Document Type and Number:
Japanese Patent JP5714361
Kind Code:
B2
Abstract:
There is provided a terminal electrode forming method which suppresses the lowering of an adhesive strength between an electrode and a ceramic so that the electrode and the ceramic do not easily peel off after forming a terminal electrode on the surface of the electrode formed on the surface of a ceramic and made of an electrode material containing a glass component. A terminal electrode 10 to connect a conducting wire is formed, with plating, on the surface of an electrode formed on the surface of the ceramic and made of an electrode material containing a glass component by the terminal electrode forming method. This method includes a first gold plating layer forming step of forming a first gold plating layer on the surface of the electrode with the plating by use of a plating liquid having a pH of 6 to 8, a nickel plating layer forming step of forming a nickel plating layer on the surface of the first gold plating layer with the plating, and a second gold plating layer forming step of forming a second gold plating layer on the surface of the nickel plating layer with the plating.
Inventors:
Takashi Ebase
Application Number:
JP2011043880A
Publication Date:
May 07, 2015
Filing Date:
March 01, 2011
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
H01L41/047; H01L41/29
Domestic Patent References:
| JP2010007172A | ||||
| JP2009164594A | ||||
| JP2006135175A | ||||
| JP2008135999A | ||||
| JP2010258056A | ||||
| JP2004300570A | ||||
| JP2008131059A | ||||
| JP2010030875A | ||||
| JP2009155671A |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike