Title:
コネクタ用端子材
Document Type and Number:
Japanese Patent JP7040544
Kind Code:
B2
Abstract:
A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
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Inventors:
Keiei Tarutani
Kenji Kubota
Naoki Kato
Kenji Kubota
Naoki Kato
Application Number:
JP2020027614A
Publication Date:
March 23, 2022
Filing Date:
February 20, 2020
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C25D7/00; C25D3/12; C25D3/46; C25D3/64; C25D5/12; H01R13/03
Domestic Patent References:
| JP2001003194A | ||||
| JP2007046142A | ||||
| JP2016065316A | ||||
| JP2016166396A |
Foreign References:
| WO2016157713A1 |
Attorney, Agent or Firm:
Masakazu Aoyama
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